Introduction of Microelectronics Airtight Packaging Ceramic Shell Packaging

Introduction of Microelectronics Airtight Packaging Ceramic Shell Packaging

Microelectronic devices can be classified into hermetic packages and non-hermetic packages. High-grade integrated circuits and discrete devices usually adopt hermetic packages of metal, ceramic, glass, etc., and have a cavity structure filled with high-purity nitrogen or other inert gases.

In general, the reliability of airtight packaging components is more than one order of magnitude higher than that of non-airtight packaging components. The design, production, testing, and inspection of airtight packaging components are strictly controlled according to military standards and aerospace standards. The failure rate is low, and they are mostly used in high-reliability applications. The airtight package device has good heat dissipation and stronger environmental adaptability. The rated operating temperature of military and aerospace components can reach -55 °C to + 125 °C. The cavity of hermetic packaging components contains a small amount of water vapor. The national and U.S. military standards have specific restrictions on the water vapor content.

This is because high water vapor content may cause some reliability problems, including internal chemical contamination, accelerated corrosion of internal metal, mainly damage to leads and bonding regions not protected by passivation layer, and may also result in poor insulation performance of components or out-of-performing parameters. The relay function may fail at low temperatures. Due to the excessive moisture content in the interior, many batches of components have failed and caused serious system disasters.

Introduction to Ceramic Packaging

The ceramic package has become an irreplaceable package material in the field of semiconductor packaging because of its excellent properties such as high airtightness, high thermal conductivity, high humidity resistance, high mechanical strength, and high insulation resistance. is particularly suitable for high-power electronic products and military and aerospace products with higher requirements.

Ceramic materials are a continuous state in the development of chip packaging. Compared with other packaging types, ceramic shell packaging has the obvious advantages of good moisture resistance and stable chemical properties. Today, Al2O3, BeO and AIN ceramics are widely used. Al2O3 ceramic production process has been developed very sophisticated, because of its relatively simple processing, high cost performance, high mechanical strength features, but also we are the most commonly used materials

As a common encapsulating material, ceramic-based encapsulating material has the advantages of low dielectric constant and good high frequency performance compared with plastic encapsulating and metal encapsulating

Good insulation and high reliability

high strength and good thermal stability

low thermal expansion coefficient and high thermal conductivity

Good air tightness and stable chemical performance

good moisture resistance and not easy to produce microcracking phenomenon