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The best choice for semiconductor laser packaging heat sink: diamond heat sink
Posted on Monday, 25 March 2024
diamond heat sink heat sink materials semiconductor lasers.
diamond heat sink Diamond, besides being regarded as a well-respected rough diamond, is also characterized by high thermal conductivity, high electrical resistivity, high breakdown field strength, l...
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Introduction of Microelectronics Airtight Packaging Ceramic Shell Packaging
Posted on Wednesday, 20 March 2024
Microelectronic devices ceramic package semiconductor packaging gold-plated
Introduction of Microelectronics Airtight Packaging Ceramic Shell PackagingMicroelectronic devices can be classified into hermetic packages and non-hermetic packages. High-grade integrated circuits an...
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Tungsten Copper Heat Sink Material for Lasers
Posted on Tuesday, 19 March 2024
Tungsten Copper Heat Sink Material for Lasers ， heat sink products ，laser
Basic information：Tungsten copper heat sink products are made of a combination of tungsten and copper in a certain proportion. They have both the low expansion characteristics of tungsten and the high...
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Understanding Gold Plated Jewelry
Posted on Tuesday, 19 March 2024
Understanding Gold Plated JewelryWhat is gilt jewelry:Gold plating is divided into two types, one is homogeneous material gold plating, the other is heterogeneous material gold plating. Homogeneous m...
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